The temperature resistance of PCB boards varies depending on the material properties of different substrates. The common FR-4 substrate typically has a TG value of around 130°C. Once the temperature exceeds this, the board is likely to deform or even fail. For high-temperature applications, high-temperature FR-4 materials can be used, which can withstand temperatures above 150°C.
 
Polyimide materials can withstand temperatures exceeding 400°C for short periods and approximately 260°C for long-term use. Ceramic-based materials are even more robust, with long-term temperature resistance exceeding 500°C. When selecting, it is essential to determine the appropriate PCB material and temperature resistance standards based on actual scenarios and requirements.