The AI computing PCB track is witnessing a definitive boom! M9 high-end material has been locked in as the absolute core driver for 2026—the NVIDIA Rubin platform has confirmed its mass adoption, and Google TPU V8 is following suit in tandem. Tailored to meet the 224Gbps ultra-high-speed transmission requirements, M9 has become the pivotal choice for breaking through computing power bottlenecks.
 
Two major technological innovations—orthogonal backplanes replacing traditional copper cables and CoWoP packaging eliminating intermediate substrates—are directly driving a soaring increase in the unit value of PCBs, which has surged several times compared with previous-generation products. Currently, leading manufacturers are accelerating the deployment of M8+/M9 production capacity, with the capacity utilization rate of high-end production lines running close to full load. Mass production is set to hit its peak in the second half of 2026, making the hundreds-of-billions-level market dividend clearly visible.
 
Enterprises that seize the opportunity of AI computing infrastructure and focus on high-end material and process upgrading will be the first to reap the benefits.